Electromigration studies of flip chip Sn95/Sb5 solder bumps on Cr/Cr-Cu/Cu under-bump metallization

Journal of Electronic Materials

Volumn 32, Issue 11, 2003, Pages 1278-1283

  Shao, T L ^a   Lin, K C ^a   Chen, Chih ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Electromigration; Failure; Flip chip; Intermetalic compound; Lead free solder; Sn95 Sb5

Indexed keywords

ANODES; ANTIMONY; CATHODES; ELECTROMIGRATION; INTERMETALLICS; METALLIZING; PHASE TRANSITIONS; SOLDERED JOINTS; TIN;

SOLDER BUMPS; UNDER BUMP METALLIZATION;

FLIP CHIP DEVICES;

EID: 0346846605     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0023-4     Document Type: Article

References (14)

1. J.D. Wu, P.J. Zheng, Kelly Lee, C.T. Chiu, and J.J. Lee, 2002 Electronic Components and Technology Conf., p. 452.
2. W.J. Choi, E.C.C. Yeh, and K.N. Tu, 2002 Electronic Components and Technology Conf., p. 1201.
3. Se-Young Jang, Wolf J., Woon-Seong Kwon, and Kyung-Wook Paik, 2002 Electronic Components and Technology Conf., p. 1213.
4. T.Y. Lee, K.N. Tu, and D.R. Frear, J. Appl. Phys. 90, 4502 (2001).
5. T.Y. Lee, K.N. Tu, S.M. Kuo, and D.R. Frear, J. Appl. Phys. 89, 3189 (2001).
6. A. Christou, Electromigration & Electronic Device Degradation (New York: John Wiley & Sons, Inc., 1994).
7. J.P. Dekker, P. Gumbsch, E. Arzt, and A. Lodder, Phys. Rev. B 59, 11 (1999).
8. Q.T. Huynh, C.Y. Liu, Chih Chen, and K.N. Tu, J. Appl. Phys. 89, 4332 (2001).
9. 2001 International Technology Roadmap for Semiconductors, Assembly and Package, p. 3.
10. D.R. Lide, Handbook of Chemistry and Physics, 2nd ed. (Boca Raton, FL: CRC Press, 1992).
11. R.J. Fields, S.R. Low III, and G.K. Lucey, Met. Sci. Joining 165 (1992).
12. R.J.K. Wassink, Soldering in Electronics, 2nd ed. (Ayr, Scotland: Electrochemical Publication Ltd., 1989).
13. C.Y. Liu, C. Chen, C.N. Liao, and K.N. Tu, Appl. Phys. Lett. 75, 58 (1999).
14. S. Brandenburg and S. Yeh, Proc. Surface Mount Int. Conf. Exhib. (Edina, MN: SMTA, 1998), p. 337.