Relieving the current crowding effect in flip-chip solder joints during current stressing

Journal of Materials Research

Volumn 21, Issue 1, 2006, Pages 137-146

  Liang, S W ^a   Shao, T L ^a   Chen, Chih ^a   Yeh, Everett C C ^b   Tu, K N ^c  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b FrontAnD Technology   (Taiwan)

^c UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COPPER; CURRENT DENSITY; ELECTRIC CONDUCTIVITY; FINITE ELEMENT METHOD; METALLIZING; THERMAL EFFECTS;

CURRENT STRESSING; FLIP-CHIP SOLDER JOINTS; UNDERBUMP METALLIZATION (UBM);

SOLDERED JOINTS;

EID: 33644510097     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2006.0004     Document Type: Article

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