Thermal gradient in solder joints under electrical-current stressing

Journal of Electronic Materials

Volumn 33, Issue 11, 2004, Pages 1350-1354

  Shao, T L ^a   Chiu, S H ^a   Chen, Chih ^a   Yao, D J ^b   Hsu, C Y ^b  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Electrical current stressing; SnAg3.5; Solder joints; Thermal gradients

Indexed keywords

DATA REDUCTION; ELECTRIC CURRENTS; INFRARED SPECTROSCOPY; METALLIZING; MICROPROCESSOR CHIPS; SILICON; THERMAL GRADIENTS; TIN ALLOYS;

ELECTRICAL-CURRENT STRESSING; SNAG3.5; UNDER BUMP METALLIZATION (UBM);

SOLDERED JOINTS;

EID: 10044228341     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0164-0     Document Type: Conference Paper

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