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1
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1842659014
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M.-D. Ker and T.-K. Tseng, Active electrostatic discharge (ESD) device for on-chip ESD protection in sub-quarter-micron complementary metal-oxide semiconductor (CMOS) process, Jpn. J. Appl. Phys. (JJAP) Part 2 Lett., 43, no. 1A/B, pp. L33-L35, 2004.
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M.-D. Ker and T.-K. Tseng, "Active electrostatic discharge (ESD) device for on-chip ESD protection in sub-quarter-micron complementary metal-oxide semiconductor (CMOS) process," Jpn. J. Appl. Phys. (JJAP) Part 2 Lett., vol. 43, no. 1A/B, pp. L33-L35, 2004.
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2
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0032309711
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How to safely apply the LVTSCR for CMOS whole-chip ESD protection without being accidentally triggered on
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M.-D. Ker and H.-H. Chang, "How to safely apply the LVTSCR for CMOS whole-chip ESD protection without being accidentally triggered on," in Proc. EOS/ESD Symp., 1998, pp. 72-85.
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(1998)
Proc. EOS/ESD Symp
, pp. 72-85
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Ker, M.-D.1
Chang, H.-H.2
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3
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23844554205
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Overview of on-chip electrostatic discharge protection design with SCR-based devices in CMOS integrated circuits
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M.-D. Bier and K.-C. Hsu, "Overview of on-chip electrostatic discharge protection design with SCR-based devices in CMOS integrated circuits," IEEE Trans. Device Mater. Reliab., vol. 5, pp. 235-249, 2005.
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IEEE Trans. Device Mater. Reliab
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Bier, M.-D.1
Hsu, K.-C.2
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4
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0025953251
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A low-voltage triggering SCR for on-chip ESD protection at output and input pads
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A. Chatterjee and T. Polgreen, "A low-voltage triggering SCR for on-chip ESD protection at output and input pads," IEEE Electron Device Lett., vol. 12, pp. 21-22, 1991.
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IEEE Electron Device Lett
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Chatterjee, A.1
Polgreen, T.2
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5
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0030836964
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A gate-coupled PTLSCR/ NTLSCR ESD protection circuit for deep-submicron low-voltage CMOS ICs
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M.-D. Ker, H.-H. Chang, and C.-Y. Wu, "A gate-coupled PTLSCR/ NTLSCR ESD protection circuit for deep-submicron low-voltage CMOS ICs," IEEE J. Solid-State Circuits, vol. 32, pp. 38-51, 1997.
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IEEE J. Solid-State Circuits
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Ker, M.-D.1
Chang, H.-H.2
Wu, C.-Y.3
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6
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0042697060
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Latchup-free ESD protection design with complementary substrate-triggered SCR devices
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M.-D. Ker and K.-C. Hsu, "Latchup-free ESD protection design with complementary substrate-triggered SCR devices," IEEE J. Solid-State Circuits, vol. 38, pp. 1380-1392, 2003.
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(2003)
IEEE J. Solid-State Circuits
, vol.38
, pp. 1380-1392
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Ker, M.-D.1
Hsu, K.-C.2
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7
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84948982831
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GGSCR: GGNMOS triggered silicon controlled rectifiers for ESD protection in deep submicron CMOS processes
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C. Russ, J. Mergens, J. Armer, P. Jozwiak, G. Kolluri, and L. Avery, "GGSCR: GGNMOS triggered silicon controlled rectifiers for ESD protection in deep submicron CMOS processes," in Proc. EOS/ESD Symp., 2001, pp. 22-31.
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Russ, C.1
Mergens, J.2
Armer, J.3
Jozwiak, P.4
Kolluri, G.5
Avery, L.6
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8
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27844508760
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Native-NMOS-triggered SCR (NANSCR) for ESD protection in 0.13-μm CMOS integrated circuits
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M.-D. Ker and K.-C. Hsu, "Native-NMOS-triggered SCR (NANSCR) for ESD protection in 0.13-μm CMOS integrated circuits," in Proc. IEEE Int. Reliability Physics Symp., 2004, pp. 381-386.
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(2004)
Proc. IEEE Int. Reliability Physics Symp
, pp. 381-386
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Ker, M.-D.1
Hsu, K.-C.2
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9
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3042514393
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Design of negative charge pump circuit with polysilicon diodes in a 0.25-μm CMOS process
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M.-D. Ker, C.-Y. Chang, and H.-C. Jiang, "Design of negative charge pump circuit with polysilicon diodes in a 0.25-μm CMOS process," in Proc. IEEE AP-ASIC Conf., 2002, pp. 145-148.
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(2002)
Proc. IEEE AP-ASIC Conf
, pp. 145-148
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Ker, M.-D.1
Chang, C.-Y.2
Jiang, H.-C.3
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10
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5444248675
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SCR device with dynamic holding voltage for on-chip ESD protection in a 0.25-μm fully salicided process
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M.-D. Ker and Z.-P. Chen, "SCR device with dynamic holding voltage for on-chip ESD protection in a 0.25-μm fully salicided process," IEEE Trans. Electron Devices, vol. 51, no. 10, pp. 1731-1733.
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IEEE Trans. Electron Devices
, vol.51
, Issue.10
, pp. 1731-1733
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Ker, M.-D.1
Chen, Z.-P.2
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11
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3042562496
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SCR devices with double-triggered technique for on-chip ESD protection in sub-quarter-micron suicided CMOS process
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M.-D. Ker and K.-C. Hsu, "SCR devices with double-triggered technique for on-chip ESD protection in sub-quarter-micron suicided CMOS process," IEEE Trans. Device Mater. Reliab., vol. 3, no. 3, pp. 58-68, 2003.
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(2003)
IEEE Trans. Device Mater. Reliab
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, Issue.3
, pp. 58-68
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Ker, M.-D.1
Hsu, K.-C.2
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12
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0011003950
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Lateral SCR devices with low-voltage high-current triggering characteristic for output ESD protection in submicron CMOS technology
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M.-D. Ker, "Lateral SCR devices with low-voltage high-current triggering characteristic for output ESD protection in submicron CMOS technology," IEEE Trans. Electron Devices, vol. 45, no. 4, pp. 849-860, 1998.
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(1998)
IEEE Trans. Electron Devices
, vol.45
, Issue.4
, pp. 849-860
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Ker, M.-D.1
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15
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0032740282
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Whole-chip ESD protection design with efficient VDD-to-VSS ESD clamp circuit for submicron CMOS VLSI
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Jan
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M.-D. Ker, "Whole-chip ESD protection design with efficient VDD-to-VSS ESD clamp circuit for submicron CMOS VLSI," IEEE Trans. Electron Devices, vol. 46, pp. 173-183, Jan. 1999.
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(1999)
IEEE Trans. Electron Devices
, vol.46
, pp. 173-183
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Ker, M.-D.1
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17
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4444266167
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ESD protection design to overcome internal damages on interface circuits of a CMOS IC with multiple separated power pins
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M.-D. Ker, C.-Y. Chang, and Y.-S. Chang, "ESD protection design to overcome internal damages on interface circuits of a CMOS IC with multiple separated power pins," IEEE Trans. Compon. Packag. Technol., vol. 27, pp. 445-451, 2004.
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IEEE Trans. Compon. Packag. Technol
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Ker, M.-D.1
Chang, C.-Y.2
Chang, Y.-S.3
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