Rapid bonding of Pyrex glass microchips

Electrophoresis

Volumn 28, Issue 6, 2007, Pages 994-1001

  Akiyama, Yoshitake ^a,b   Morishima, Keisuke ^b,c   Kogi, Atsuna ^a   Kikutani, Yoshikuna ^c   Tokeshi, Manabu ^a,c,d   Kitamori, Takehiko ^a,c,e  

^a Institute of Microchemical Technology   (Japan)

^b TOKYO UNIVERSITY OF AGRICULTURE AND TECHNOLOGY   (Japan)

^c KANAGAWA ACADEMY OF SCIENCE AND TECHNOLOGY   (Japan)

^d NAGOYA UNIVERSITY   (Japan)

^e UNIVERSITY OF TOKYO   (Japan)

Author keywords

Microchip; Microelectrode; Pyrex glass; Rapid bonding

Indexed keywords

DUST; GLASS BONDING; GLASS SUBSTRATES; MICROPROCESSOR CHIPS; PRESSES (MACHINE TOOLS); TENSILE STRENGTH;

FABRICATION PROCESS; GLASS SUBSTRATES; HIGH PRESSURE; MICROCHEMICAL CHIPS; MICROCHIP; PISTON CYLINDERS; PYREX GLASS; RAPID BONDING; THERMAL BONDING; VACUUM CHAMBERS;

GLASS;

GLASS;

ARTICLE; CHEMICAL BINDING; CHEMICAL MODIFICATION; COOLING; HEATING; MATERIALS TESTING; MICROELECTROMECHANICAL SYSTEM; PRESSURE; PRODUCTIVITY; TEMPERATURE STRESS; TENSILE STRENGTH; THICKNESS; VACUUM;

EID: 34147160764     PISSN: 01730835     EISSN: 15222683     Source Type: Journal    
DOI: 10.1002/elps.200600437     Document Type: Article

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