Fabrication of fine metal microstructures packaged in the bonded glass substrates

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3893, Issue , 1999, Pages 486-493

  Kawamura, Akihito ^a   Ike, Shinichi ^a   Shoji, Shuichi ^a  

^a WASEDA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; BONDING; COSTS; ELECTROMAGNETIC WAVE DIFFRACTION; ELECTROPLATING; GLASS; MASKS; METALLOGRAPHIC MICROSTRUCTURE; PHOTORESISTS; REACTIVE ION ETCHING; SUBSTRATES;

LOW TEMPERATURE BONDING; MICROPACKAGING; ULTRAVIOLET LITHOGRAPHY;

MICROELECTRONICS;

EID: 0033316657     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)