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Volumn , Issue , 2004, Pages 26-29
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Fabrications of micro-channel device by hot emboss and direct bonding of PMMA
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESIVES;
BOND STRENGTH (CHEMICAL);
BONDING;
LIGHT ABSORPTION;
MICROELECTROMECHANICAL DEVICES;
SURFACE TENSION;
ULTRASONIC CLEANING;
WATER;
BONDED INTERFACE;
EMBOSSING;
MICRO-CHANNEL DEVICES;
POLYMETHYL METHACRYLATES;
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EID: 16244384619
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (18)
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References (1)
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