Development of novel low temperature bonding technologies for microchip chemical analysis applications

Sensors and Actuators, A: Physical

Volumn 84, Issue 1, 2000, Pages 103-108

  Sayah, A ^a   Solignac, D ^a   Cueni, T ^a   Gijs, M A M ^a  

^a EPFL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL ANALYSIS; ELECTROPHORESIS; ETCHING; GLASS; HIGH PRESSURE EFFECTS; LOW TEMPERATURE EFFECTS; MICROSTRUCTURE; PLASMA APPLICATIONS; SCANNING ELECTRON MICROSCOPY; SUBSTRATES;

LOW TEMPERATURE BONDING; MICROCHANNELS; MICROPOWDER BLASTING; PLASMA ASSISTED BONDING;

BONDING;

EID: 0034249327     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(99)00346-5     Document Type: Article

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