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Volumn 102, Issue 2-3, 2007, Pages 144-151

Chemical mechanical planarization of copper using abrasive-free solutions of oxalic acid and hydrogen peroxide

Author keywords

CMP; Copper; Oxalic Acid; Semiconductor devices; Surface composition

Indexed keywords

ACIDITY; CHEMICAL MECHANICAL POLISHING; DISSOLUTION; HYDROGEN PEROXIDE; SLURRIES; SURFACE PROPERTIES; WEAR RESISTANCE;

EID: 33847617437     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2006.11.015     Document Type: Article
Times cited : (57)

References (45)
  • 15
    • 33847635531 scopus 로고    scopus 로고
    • V.R.K. Gorantla, Ph.D. Thesis, Clarkson University, 2004.
  • 18
    • 33847621964 scopus 로고    scopus 로고
    • http://people.clarkson.edu/∼samoy/ECMP.htm
  • 38
    • 33847622391 scopus 로고    scopus 로고
    • M. Pourbaix, Atlas of Electrochemical Equilibria in Aqueous Solutions, NACE International, Houston, 1974.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.