Electrochemical impedance characteristics of Ta/Cu contact regions in polishing slurries used for chemical mechanical planarization of Ta and Cu: Considerations of galvanic corrosion

Corrosion Science

Volumn 48, Issue 2, 2006, Pages 372-388

  Assiongbon, K A ^a   Emery, S B ^a   Gorantla, V R K ^a   Babu, S V ^a   Roy, D ^a  

^a CLARKSON UNIVERSITY   (United States)

Author keywords

Chemical mechanical planarization; Copper electrode; Galvanic corrosion; Impedance spectroscopy; Tantalum electrode

Indexed keywords

COPPER; ELECTROCHEMICAL CORROSION; ELECTRODES; GALVANIZING; IONIC CONDUCTION; POLARIZATION; TANTALUM;

CHEMICAL MECHANICAL PLANARIZATION; COPPER ELECTRODE; GALVANIC CORROSION; IMPEDANCE SPECTROSCOPY; TANTALUM ELECTRODE;

ELECTRIC IMPEDANCE;

ELECTROCHEMICAL ANALYSIS; GALVANIC CORROSION; MECHANICAL PROPERTY; SLURRY;

EID: 29244444169     PISSN: 0010938X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.corsci.2005.01.008     Document Type: Article

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