Experimental and numerical analysis of an inhibitor-containing slurry for copper chemical mechanical planarization

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 44, Issue 1 A, 2005, Pages 82-86

  Zhuang, Yun ^a   Li, Zhonglin ^a   Shimazu, Yoshitomo ^b   Uotani, Nobuo ^b   Borucki, Leonard ^c   Philipossian, Ara ^a  

^a UNIVERSITY OF ARIZONA   (United States)

^b Showa Denko Materials Co   (Japan)

^c Intelligent Planar   (United States)

Author keywords

BTA inhibitor; Coefficient of friction; Copper CMP; Modified Langmuir Hinshelwood model; Pad and wafer temperatures; Preston Equation

Indexed keywords

COMPUTER SIMULATION; COPPER; COPPER CORROSION; MATHEMATICAL MODELS; NUMERICAL ANALYSIS; PH EFFECTS; SLURRIES;

BENZOTRIAZOLE (BTA) INHIBITOR; COEFFICIENT OF FRICTION (COF); COPPER CHEMICAL MECHANICAL PLANARIZATION (CMP); MODIFIED LANGMUIR-HINSHELWOOD MODELS; PAD AND WAFER TEMPERATURES; PRESTON EQUATIONS;

INTEGRATED CIRCUITS;

EID: 15544362093     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.44.82     Document Type: Article

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