Development of "new abrasive-free copper CMP solutions" based on electrochemical and film analysis method

Materials Research Society Symposium Proceedings

Volumn 732, Issue , 2002, Pages 8-19

  Amanokura, Jin ^a   Kamigata, Yasuo ^a   Habiro, Masanobu ^a   Suzuki, Hiroshi ^a   Hanazono, Masanobu ^a  

^a Showa Denko Materials Co   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; COPPER; ELECTROCHEMISTRY; EROSION; TOPOGRAPHY;

COMPLEX FILM ANALYSIS; MICROSCRATCHES; REMOVAL RATE;

CHEMICAL MECHANICAL POLISHING;

EID: 34249878758     PISSN: 02729172     EISSN: None     Source Type: Journal    
DOI: 10.1557/proc-732-i1.2     Document Type: Article

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