Role of iodate ions in chemical mechanical and electrochemical mechanical planarization of Ta investigated using time-resolved impedance spectroscopy

Materials Letters

Volumn 59, Issue 29-30, 2005, Pages 3885-3889

  Pettit, C M ^a   Roy, D ^a  

^a CLARKSON UNIVERSITY   (United States)

Author keywords

CMP; ECMP; EIS; Electronic materials; Iodate; Tantalum

Indexed keywords

ABRASION; CATALYSIS; ELECTROCHEMISTRY; HYDROGEN PEROXIDE; IONS; PRESSURE EFFECTS; REACTION KINETICS; SPECTROSCOPIC ANALYSIS; TANTALUM;

CHEMICAL MECHANICAL PLANARIZATION (CMP); EIS; ELECTROCHEMICAL MECHANICAL PLANARIZATION (ECMP); ELECTRONIC MATERIALS; IODATE;

IODINE COMPOUNDS;

EID: 26844528590     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2005.07.025     Document Type: Article

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