Low resistance TiAlTi-WAu Ohmic contact to n-GaN for high temperature applications

Applied Physics Letters

Volumn 90, Issue 8, 2007, Pages

  Fernandez S ^a   Pena R ^a   Rodrigo, M T ^a   Plaza, J ^a   Verdu M ^a   Sanchez F J ^a   Montojo, M T ^a  

^a DEPT OF ENVIRONMENTAL CHEMISTRY   (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; DIFFUSION; ELECTRIC RESISTANCE; HIGH TEMPERATURE APPLICATIONS; INTERMETALLICS; METALLIZING; SPECTROSCOPIC ANALYSIS;

DIFFUSION BARRIER LAYERS; ENERGY DISPERSION SPECTROSCOPY; INTERMETALLIC REACTIONS; MICROSTRUCTURAL CONTACTS;

OHMIC CONTACTS;

EID: 33847189500     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2539670     Document Type: Article

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