Solidification shrinkage defects in electronic solders

JOM

Volumn 57, Issue 6, 2005, Pages 38-42

  Wable, Girish S ^a   Chada, Srinivas ^a   Neal, Bryan ^a   Fournelle, Raymond A ^b  

^a JABIL CIRCUIT INC   (United States)

^b Marquette University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECTS; DISSOLUTION; EUTECTICS; LEAD ALLOYS; PHASE COMPOSITION; SHRINKAGE; SOLDERED JOINTS; SOLIDIFICATION; SUBSTRATES; SURFACE ROUGHNESS; TIN ALLOYS;

ELECTRONIC SOLDERS; SOLIDIFICATION SHRINKAGE DEFECTS;

SOLDERING ALLOYS;

EID: 22944451466     PISSN: 10474838     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11837-005-0134-x     Document Type: Review

References (14)

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