Vibration reliability characterization of PBGA assemblies

Microelectronics Reliability

Volumn 40, Issue 7, 2000, Pages 1097-1107

  Yang, Q J ^a   Pang, H L J ^b   Wang, Z P ^a   Lim, G H ^b   Yap, F F ^b   Lin, R M ^b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MODAL ANALYSIS; PRINTED CIRCUIT BOARDS; RELIABILITY; STIFFNESS; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING; VIBRATIONS (MECHANICAL);

PLASTIC BALL GRID ARRAYS (PBGA);

ELECTRONICS PACKAGING;

EID: 0034228456     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(00)00036-6     Document Type: Article

References (15)

1. Allemang RJ, Brown DJ. A correlation coefficient for modal vector analysis. Proceedings of First International Modal Analysis Conference. 1982. p. 110-6.
2. Barker DB, Chen YS, Dasgupta A. Estimating the vibration fatigue life of quad leaded surface mount components. J Electron Packag 1993;115:195-200.
3. Barker DB, Chen YS. Modeling the vibration restraints of wedge lock card guides. J Electron Packag 1993;115:189-94.
4. Lau J, Marcotte T, Severine J, Lee A, Erasmus, Baker T, Moldaschel J, Sporer M, Burward-Hoy G. Solder joint reliability of surface mount connectors. J Electron Packag 1993;115:180-188.
5. Liguore S, Fields S, Followell D, Perez R. Vibration fatigue of leadless chip carrier solder joints. ASME paper 92-WA/EEP-25, 1992.
6. McMurray KE, Mitchell LD. Characterization of boundary conditions for wedge-lock-mounted printed circuit boards. Adv Electron Packag 1997;EEP-19-2:1321-7.
7. Pitarresi JM, Akanda A. Random vibration response of a surface mount lead/solder joint. Adv Electron Packag 1993;EEP-4-1:207-15.
8. Pitarresi JM. Modeling of printed circuit boards subject to vibration. IEEE Int Symp Circuits Sys 1990;3:2104-7.
9. Pitarresi JM, Caletka DV, Caldwell R, Smith DE. The smeared, property technique for the FE vibration analysis of printed circuit cards. J Electron Packag 1991;115:250-7.
10. Roberts JC, Stillo DM. Random vibration analysis of printed wiring board with electronic components. J IES 1991;34:25-31.
11. Sidharth, Barker DB. Vibration induced fatigue life estimation of corner leads of peripheral leaded components. J Electron Packag 1996;118:244-9.
12. Steinberg DS. Vibration analysis for electronic equipment. New York: Wiley, 1988.
13. Structural Measurement System. The star system. 1990.
14. Wong TL, Stevens KK, Wang G. Experimental modal analysis and dynamic response prediction of PC boards with surface mount electronic components. J Electron Packag 1991;113:244-9.
15. Yang QJ, Lim GH, Lin RM, Yap FF, Pang HLJ, Wang ZP. Experimental modal analysis of PBGA printed circuit board assemblies. Proceedings of First Electronic Packaging Technology Conference, Singapore. 1997. p. 290-6.