Investigation of vibration fracture behavior of Sn-Ag-Cu solders under resonance

Journal of Materials Research

Volumn 19, Issue 9, 2004, Pages 2665-2673

  Song, Jenn Ming ^a   Li, Fang I ^a   Lui, Truan Sheng ^a   Chen, Li Hui ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DAMPING; FRACTURE; INTERMETALLICS; MICROSTRUCTURE; MORPHOLOGY; SOLDERING ALLOYS; SURFACES; TENSILE STRENGTH;

DAMPING CAPACITY; FRACTURE RESISTANCE; VIBRATION FRACTURE;

TIN ALLOYS;

EID: 6044263752     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2004.0354     Document Type: Article

References (22)

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