Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder

Microelectronics Reliability

Volumn 46, Issue 2-4, 2006, Pages 459-466

  Kim, Youngbae ^a   Noguchi, Hiroshi ^a   Amagai, Masazumi ^b  

^a KYUSHU UNIVERSITY   (Japan)

^b Texas Instruments Japan Ltd   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; RELIABILITY; SOLDERED JOINTS; STRESS ANALYSIS; VIBRATIONS (MECHANICAL); VISCOPLASTICITY;

BGA-IC PACKAGE; MICROPROBE ANALYSIS; PB-FREE SOLDER; VIBRATION FATIGUE RELIABILITY;

ELECTRONICS PACKAGING;

EID: 30844437500     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.02.003     Document Type: Article

References (8)

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3. M. Amagai, M. Watanabe, M. Omiya, K. Kishimoto, and T. Shibuya Mechanical characterization of Sn-Ag-based lead-free solders Microelectron Reliab 42 2002 951 966
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8. P.L. Tu, Y.C. Chan, C.W. Tang, and J.K.L. Lai Effects of intermetallic compounds on vibration fatigue of μBGA solder joint IEEE Trans Adv Pack 24 2 2001 197 205