Fatigue crack growth behavior of Sn-Pb and Sn-based lead-free solders

Engineering Fracture Mechanics

Volumn 70, Issue 15, 2003, Pages 2187-2197

  Zhao, Jie ^a,b   Mutoh, Yoshiharu ^b   Miyashita, Yukio ^b   Wang, Lai ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^b NAGAOKA UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

Creep effect; Cyclic dependence; Fatigue crack growth; Solder; Time dependence

Indexed keywords

ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; SOLDERING ALLOYS; STRESSES; TIN ALLOYS;

FATIGUE CRACK GROWTH (FCG);

CRACK PROPAGATION;

CORROSION; CREEP; FATIGUE CRACK; LEAD; SOLDER; TEMPERATURE EFFECT;

EID: 0041340556     PISSN: 00137944     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0013-7944(02)00252-7     Document Type: Article

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