Low cycle fatigue behavior of Sn-3.8Ag-0.7Cu lead-free solder

Cailiao Yanjiu Xuebao/Chinese Journal of Materials Research

Volumn 18, Issue 1, 2004, Pages 11-17

  Zeng, Qiulian ^a   Wang, Zhongguang ^a   Xian, Aiping ^a   Shang, Jianku ^a,b  

^a INSTITUTE OF METAL RESEARCH   (China)

^b University of Illinois at Urbana Champaign   (United States)

Author keywords

Cycle dependent softening; Lead free solder; Low cycle fatigue; Mechanical properties; Metallic materials; Sn alloy

Indexed keywords

FATIGUE OF MATERIALS; MECHANICAL PROPERTIES; METALLOGRAPHIC MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; STRAIN; STRESSES; TIN ALLOYS;

COFFIN MANSON EQUATION; CYCLE DEPENDENT SOFTENING; FRACTURE MECHANISM; LEAD FREE SOLDER; LOW CYCLE FATIGUE; MICROSTRUCTURAL VARIATIONS; STRAIN AMPLITUDES;

SOLDERING ALLOYS;

EID: 2942608212     PISSN: 10053093     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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