Direct write lithography: the global solution for R&D and manufacturing

Comptes Rendus Physique

Volumn 7, Issue 8, 2006, Pages 910-923

  Pain, Laurent ^a   Tedesco, Serge ^a   Constancias, Christophe ^a  

^a CEA LETI   (France)

Author keywords

Direct write; E beam; Lithography; Prototyping

Indexed keywords

EID: 33751535490     PISSN: 16310705     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.crhy.2006.10.003     Document Type: Short Survey

References (32)

1. Thornley R.F.M., and Hatzakis M. 9th Symp. Electron, Ion, and Laser Beam Technol. (1967), San Francisco Press 94
2. B. Arnold, Executive millennium report: 1999 roadmap: Solutions and caveats, Solid State Technology
3. L. Pain, Europe SEMICON presentation, April 2006
4. Lin B.J. Microelectron. Eng. 83 (2006) 604-613
5. Trybula W. Microelectron. Eng. 83 (2006) 614-618
6. Pain L., et al. Jpn. J. Appl. Phys. 43 6B (2004) 3755-3761
7. Chen W., and Ahmed H. Appl. Phys. Lett. 62 13 (1993)
8. Namatsu H., Yamaguchi T., Nagase M., Yamasaki K., and Kurihara K. Microelectron. Eng. 41/42 (1998) 331-334
9. Maile B.E., et al. Jpn. J. Appl. Phys. 39 (2000) 6836-6842
10. Mollard L., Cunge G., Tedesco S., Dal'zotto B., and Foucher J. Microelectron. Eng. 61/62 (2002) 755
11. Fujita J., Ohnishi Y., Ochiai Y., and Matsui S. Appl. Phys. Lett. 68 9 (26 February 1996)
12. G Robinson A.P., et al. Microelectron. Eng. 83 (2006) 1115-1118
13. Todeschini J., et al. Proc. SPIE 5753 (2005) 408
14. Landis S., et al. Jpn. J. Appl. Phys. 43 (2004) 3974
15. B. Icard, et al., paper presented at EIPBN conference, 2006, in press
16. Satoh H., et al. Proc. SPIE 3096 (1997) 72-83
17. PROXECCO 3.4 Documentation Copyright ©2001 by PDF solutions GmbH, aiss Division
18. S. Manakli, et al., paper presented at MNC conference, 2005, in press
19. Deleonibus S., et al. IEEE Electron Dev. Lett. 4 (2000) 173-175
20. Tedesco S., et al. J. Vac. Sci. Technol. B 16 6 (November/December 1998)
21. Steen S. Proc. SPIE 5751 (2005) 26-34
22. Pain L., et al. Proc. SPIE 5751 (2005) 35-45
23. F. Arnaud, in: Symposium on VLSI Technol., 2004, pp. 10-11
24. F. Boeuf, et al., in: Symposium on VLSI Technol., 2005, pp. 130-131
25. Yamada, et al. J. Vac. Sci. Technol. B 21 6 (2003) 2680-2685
26. Inamani R. Proc. SPIE 5037 (2003) 1043-1050
27. Nakasugi T. Proc. SPIE 5037 (2003) 1051-1058
28. Yamada, in: ISMT CPL Workshop, Vienna, 23rd September 2005
29. B. Van Kampherbeck, in: ISMT Vancouver Workshop, May 2006
30. Döring H., et al. Proc. SPIE 5751 (2005) 355
31. Sandstrom T., et al. Proc. SPIE 4562 (2002) 38
32. Beauvais J., et al. Proc. SPIE 5751 (2005) 518-526