Electron beam direct write lithography flexibility for ASIC manufacturing an opportunity for cost reduction

Progress in Biomedical Optics and Imaging - Proceedings of SPIE

Volumn 5751, Issue I, 2005, Pages 35-45

  Pain, L ^a   Jurdit, M ^a   Todeschini, J ^c   Manakli, S ^b   Icard, B ^a   Minghetti, B ^b   Bervin, G ^b   Beverina, A ^b   Leverd, F ^b   Broekaart, M ^c   Gouraud, P ^b   De Jonghe, V ^c   Brun, Ph ^a   Denorme, S ^b   Boeuf, F ^b   Wang, V ^d   Henry, D ^b  

^a CEA GRENOBLE   (France)

^b STMICROELECTRONICS   (France)

^c NXP SEMICONDUCTORS   (Netherlands)

^d FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

E Beam; Flexibility; Lithography; Photoresist; Repair; SRAM

Indexed keywords

COSTS; ELECTRON BEAMS; PHOTORESISTS; PRODUCTION ENGINEERING; REPAIR; RESEARCH AND DEVELOPMENT MANAGEMENT; SEMICONDUCTOR MATERIALS; STATIC RANDOM ACCESS STORAGE;

ARCHITECTURE DESIGNS; E-BEAM; FLEXIBILITY; MASK LESS LITHOGRAPHY;

LITHOGRAPHY;

EID: 24644435414     PISSN: 16057422     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.601498     Document Type: Conference Paper

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