Electrochemical Study on Electroless Copper Plating Using Sodium Hypophosphite as Reductant

Acta Physico - Chimica Sinica

Volumn 22, Issue 11, 2006, Pages 1317-1321

  Yang, Fangzu ^a   Yang, Bin ^a   Lu, Binbin ^a   Huang, Ling ^a   Xu, Shukai ^a   Zhou, Shaomin ^a  

^a XIAMEN UNIVERSITY   (China)

Author keywords

Anodic oxidation; Cathodic reduction; Electroless copper plating; Re active agent; Sodium hypophosphite

Indexed keywords

EID: 33751204144     PISSN: 18721508     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1872-1508(06)60065-X     Document Type: Article

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