Understanding the effect of additives in electroless copper deposition: Correlating deposition rates with absorption and complexation

Plating and Surface Finishing

Volumn 92, Issue 3, 2005, Pages

  Chang, Jun Shang ^a   Kou, Show Chin ^b   Hung, Aina ^b  

^a TA HWA INSTITUTE OF TECHNOLOGY   (Taiwan)

^b NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; ADDITION REACTIONS; ADDITIVES; CAPACITANCE MEASUREMENT; CHARGE TRANSFER; COMPLEXATION; COMPOSITION EFFECTS; ELECTROLESS PLATING; ORGANIC COMPOUNDS; SPECTROSCOPIC ANALYSIS; SULFUR COMPOUNDS; SURFACE REACTIONS;

AC IMPEDANCE SPECTROSCOPY; CHARGE TRANSFER RESISTANCE; DEPOSITION RATES; DIPYRIDINE; RHODANINE; SODIUM THIOSULFATE;

COPPER PLATING;

EID: 15744375568     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

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