Electroless deposition of copper in acidic solutions using hypophosphite reducing agent

Journal of Applied Electrochemistry

Volumn 36, Issue 1, 2006, Pages 69-75

  Touir, R ^a   Larhzil, H ^a   Ebntouhami, M ^a   Cherkaoui, M ^a   Chassaing, E ^b  

^a IBN TOFAIL UNIVERSITY   (Morocco)

^b Ctr d'Etud Chim M   (France)

Author keywords

Acid electroless copper deposition; Autocatalytic copper deposition; Hypophosphite solutions; Ni Cu P electroless deposition

Indexed keywords

CATALYSIS; COMPOSITION; COPPER ALLOYS; FORMALDEHYDE; MORPHOLOGY; PHOSPHORUS;

ACID ELECTROLESS COPPER DEPOSITION; AUTOCATALYTIC COPPER DEPOSITION; HYPOPHOSPHITE SOLUTIONS; NI-CU-P ELECTROLESS DEPOSITION;

ELECTRODEPOSITION;

EID: 30444456543     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10800-005-9025-7     Document Type: Article

References (27)

1. V.M. Dubin, Y. ShachamDiamand, B. Zhao, P.K. Vasudev and C.H. Ting, J. Electrochem. Soc. 144 (1997) 898.
2. M. Topper, T. Stolle and H. Reichl, 'Low cost electroless copper metallization of BCB for high-density wiring systems', proceedings of International Symposium on AD. IEEE Int Microelectr. and Packaging Soc. (1999) pp. 202-208.
3. E.J. OSullivan, in L. T. Romankiw, T. Osaka, Y. Yamasaki and C. Madore (Eds) 'Electrochemical Technology', (Electrochem. Soc. Japan, 2000), p. 159.
4. Y.Y. ShachamDiamand, Electrochem. Solid State Lett. 3 (2000) 279.
5. J.J. Kim and S.H. Cha, Jpn. J. Appl. Phys. Part 1 Regular Papers Short Notes and Review Papers, 40 (2001) 7151.
6. J.J. Kim, S.H. Cha and Y.S. Lee, Jpn. J. Appl. Phys. Part 2 Letters 42 (2003) L953.
7. S.W. Hong, Y.S. Lee, Y.K. Lee, I.S. Kim, K.C. Park, M. Kim and J.W. Park, Jpn. J.Appl. Phys. Part 1 Regular Papers Short Notes and Review Papers 43 (2004) 6981.
8. T.H. Meen, W.R. Chen, C.J. Huang and C.J. Chiu, Jpn. J.Appl. Phys. Physics Part 1 Regular Papers Short Notes and Review Papers 1 (2004) 5100.
9. C.H. Ting and M. Paunović, J. Electrochem. Soc. 136 (1989) 456.
10. F. Wang, S. Arai and M. Endo, Electrochem. Commun. 6 (2004) 1042.
11. Z.L. Wang, O. Yaegashi, H. Sakaue, T. Takahagi and S. Shingubara, J. Electrochem. Soc. 151 (2004) C781.
12. I. Ohno, O. Wakabayashi and S. Haruyama, J. Electrochem. Soc. 132 (1985) 2323.
13. M. Paunovic, in M. Schlesingcr and M. Paunovic (Eds), 'Modern Electroplating', (John Wiley & Sons, New York, Chichester, Weinheim, Brisbane, Singapore, Toronto 2000), pp. 645-666.
14. A. Vaskelis, R. Juskenas and J. Jaciauskiene, Electrochim. Acta 43 (1998) 1061.
15. R. Jagannathan and M. Krishnan, IBM J. Res. Develop. 37 (1993) 117.
16. A. Hung and K.-M. Chen, J. Electrochem. Soc. 136 (1989) 72.
17. M. Cherkaoui, A. Srhiri and E. Chassaing Plating Surf. Finish. 79 (1992) 68.
18. J.G. Gaudiello and G.L. Ballard IBM J. Res. Develop. 37 (1993) 107.
19. L.D. Burke, G.M. Bruton and J.A. Collins, Electrochim. Acta 44 (1998) 1467.
20. S. Armyanov, O. Steenhout, N. Krasteva, J. Georgieva, J.L. Delplancke, R. Winand and J. Vereecken, J. Electrochem. Soc. 143 (1996) 3692.
21. E. Valova, S. Armyanov, J.L. Delplancke, R. Winand, O. Steenhaut and J. Vereecken, J. Electrochem. Soc. 143 (1996) 2804.
22. C.J. Chen and K.L. Lin, J. Electrochem. Soc. 146 (1999) 137.
23. I. Ohno, in M Paunovic, M. Datta, M. Matlosz, T. Osaka and J.B. Talbot (Eds), 'Proceedings of the symposium', (The Electrochem. Soc., 1998) pp. 255-269.
24. M. Saaoudi, E. Chassaing, M. Cherkaoui and M. EbnTouhami, J. Appl. Electrochem. 32 (2002) 1331.
25. E. Chassaing, M. Cherkaoui and A. Srhiri, J. Appl. Electrochem. 23 (1993) 1169.
26. J. Li and P.A. Kohl, J. Electrochem. Soc. 150 (2003) C558.
27. J. Li and P.A. Kohl, J. Electrochem. Soc. 149 (2002) C631.