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Volumn 24, Issue 2, 2006, Pages 803-806

Bottom-up fill mechanisms of electroless copper plating with addition of mercapto alkyl carboxylic acid

Author keywords

[No Author keywords available]

Indexed keywords

CARBOXYLIC ACIDS; DIFFUSION; ELECTROLESS PLATING; ELECTROPLATING; SEMICONDUCTOR DEVICES;

DAMASCENE PROCESS; INHIBITOR MOLECULES; INTERCONNECTIONS;

COPPER PLATING;

EID: 33645521916 PISSN: 10711023 EISSN: None Source Type: Journal
DOI: 10.1116/1.2167988 Document Type: Article

Times cited : (20)

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