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Volumn 153, Issue 4, 2000, Pages 211-217
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Copper electroless deposition on NiTi shape memory alloy: An XPS study of Sn-Pd-Cu growth
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESION;
CHEMICAL BONDS;
CHEMISORPTION;
COPPER PLATING;
DISSOCIATION;
ELECTROLESS PLATING;
FILM GROWTH;
METALLIC FILMS;
NUCLEATION;
PALLADIUM;
SHAPE MEMORY EFFECT;
TINNING;
CLUSTERS;
TITANIUM ALLOYS;
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EID: 0033877991
PISSN: 01694332
EISSN: None
Source Type: Journal
DOI: 10.1016/S0169-4332(99)00280-9 Document Type: Article |
Times cited : (19)
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References (24)
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