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Volumn 153, Issue 4, 2000, Pages 211-217

Copper electroless deposition on NiTi shape memory alloy: An XPS study of Sn-Pd-Cu growth

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CHEMICAL BONDS; CHEMISORPTION; COPPER PLATING; DISSOCIATION; ELECTROLESS PLATING; FILM GROWTH; METALLIC FILMS; NUCLEATION; PALLADIUM; SHAPE MEMORY EFFECT; TINNING;

EID: 0033877991     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(99)00280-9     Document Type: Article
Times cited : (19)

References (24)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.