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Electrochimica Acta

Volumn 49, Issue 11, 2004, Pages 1789-1795

The influence of 2,2′-dipyridyl on non-formaldehyde electroless copper plating

(3) Li, Jun a Hayden, Harley a Kohl, Paul A a

a GEORGIA INSTITUTE OF TECHNOLOGY (United States)

Author keywords

2,2 Dipyridyl; Copper; Electroless copper plating; Hypophosphite

Indexed keywords

ADDITIVES; ATOMIC FORCE MICROSCOPY; CATALYSIS; COMPOSITION; CURRENT VOLTAGE CHARACTERISTICS; CYCLIC VOLTAMMETRY; ELECTROCHEMISTRY; ELECTROLESS PLATING; MICROSTRUCTURE; NICKEL; ORGANIC COMPOUNDS; OXIDATION; PROFILOMETRY; REDUCTION; SURFACE ROUGHNESS; X RAY DIFFRACTION ANALYSIS;

2,2′-DIPYRIDYL; ELECTROLESS COPPER PLATING; HYDROPHOSPHITE;

COPPER PLATING;

EID: 1142304493 PISSN: 00134686 EISSN: None Source Type: Journal
DOI: 10.1016/j.electacta.2003.12.010 Document Type: Article

Times cited : (72)

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