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Volumn 150, Issue 8, 2003, Pages
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The deposition characteristics of accelerated nonformaldehyde electroless copper plating
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Author keywords
[No Author keywords available]
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Indexed keywords
CATALYST ACTIVITY;
COMPOSITION;
DEPOSITION;
ELECTROPLATING;
OXIDATION;
PHOSPHORUS COMPOUNDS;
RATE CONSTANTS;
SCANNING ELECTRON MICROSCOPY;
SODIUM COMPOUNDS;
SOLUTIONS;
STRUCTURE (COMPOSITION);
SULFUR COMPOUNDS;
ELECTROLESS COPPER PLATING;
FOMAMIDINE DISULFIDE;
SODIUM CITRATE;
SODIUM HYPOPHOSPHITE;
COPPER PLATING;
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EID: 0042208252
PISSN: 00134651
EISSN: None
Source Type: Journal
DOI: 10.1149/1.1591760 Document Type: Article |
Times cited : (53)
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References (16)
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