SCOPUS 정보 검색 플랫폼

Volumn 178, Issue 1-4, 2001, Pages 116-126

Effects of additives and chelating agents on electroless copper plating

Author keywords

Additives; Chelating effect; Electroless copper plating; Ethylenediamine; Ethylenediaminetetraacetic acid; Triethanolamine

Indexed keywords

ACETIC ACID; ADDITIVES; ADSORPTION; AGENTS; AMINES; ATOMIC FORCE MICROSCOPY; CHELATION; COMPLEXATION; ELECTRIC POTENTIAL; ELECTROLESS PLATING; FORMALDEHYDE; OXIDATION; SURFACE ROUGHNESS; X RAY DIFFRACTION ANALYSIS;

CHELATING EFFECTS; ETHYLENEDIAMINES; ETHYLENEDIAMINETETRAACETIC ACID; TRIETHANOLAMINES;

COPPER PLATING;

EID: 0035797066 PISSN: 01694332 EISSN: None Source Type: Journal
DOI: 10.1016/S0169-4332(01)00306-3 Document Type: Article

Times cited : (111)

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