Electroless copper plating using FeII as a reducing agent

Electrochimica Acta

Volumn 49, Issue 2, 2004, Pages 233-238

  Sone, Michinari ^a   Kobayakawa, Koichi ^a   Saitou, Makoto ^b   Sato, Yuichi ^a  

^a KANAGAWA UNIVERSITY   (Japan)

^b Yoshino Denka Kogyo Inc   (Japan)

Author keywords

Electroless copper plating; FeII complex; Reducing agent

Indexed keywords

AGENTS; COPPER; DEPOSITION; ELECTRIC CONDUCTIVITY; ELECTROLESS PLATING; IRON; POLYETHYLENE GLYCOLS;

REDUCING AGENTS;

COPPER PLATING;

EID: 0345327825     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2003.07.004     Document Type: Article

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