The acceleration of nonformaldehyde electroless copper plating

Journal of the Electrochemical Society

Volumn 149, Issue 12, 2002, Pages

  Li, Jun ^a   Kohl, Paul A ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACETIC ACID; ALDEHYDES; COPPER; CRYSTAL STRUCTURE; DERIVATIVES; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTROCHEMISTRY; OXIDATION; PH; REACTION KINETICS; SOLUTIONS; UREA;

COMPLEXING AGENT; HYDROXYETHYL ETHYLENEDIAMINETRIACETIC ACID TRISODIUM SALT HYDRATE; HYPOPHOSPHITE; NONFORMALDEHYDE ELECTROLESS COPPER PLATING; THIOUREA;

ELECTROLESS PLATING;

EID: 0036964455     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1517582     Document Type: Article

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