Adhesion behavior of electroless deposited Cu on Pt/Ta silicate and Pt/SiO 2

Applied Surface Science

Volumn 222, Issue 1-4, 2004, Pages 253-262

  Garza, M ^a   Liu, J ^a   Magtoto, N P ^a   Kelber, J A ^a  

^a UNIVERSITY OF NORTH TEXAS   (United States)

Author keywords

Adhesion; Copper; Growth mechanism; XPS

Indexed keywords

ADHESION; AGGLOMERATION; CATALYSIS; COPPER; ELECTRODEPOSITION; ELECTROLESS PLATING; GROWTH (MATERIALS); MONOLAYERS; OXIDATION; SILICA; SILICATES; SPUTTER DEPOSITION; SUBSTRATES; THIN FILMS; ULTRAHIGH VACUUM; X RAY PHOTOELECTRON SPECTROSCOPY;

CONFORMAL GROWTH; ELEMENTAL SENSITIVITY FACTORS; ION GAUGE SENSITIVITIES; SPECTRAL INTENSITY;

SURFACE PHENOMENA;

EID: 0346753480     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2003.08.103     Document Type: Article

References (33)

1. Shepherd K., Kelber J. Appl. Surf. Sci. 151:1999;287.
2. Chen L., Magtoto N.P., Ekstrom B., Kelber J.A. Thin Solid Films. 376:2000;115.
3. Ekstrom B.M., Lee S., Magtoto N., Kelber J.A. Appl. Surf. Sci. 171:2001;275.
4. Zhao X., Leavy M., Magtoto N.P., Kelber J.A. Appl. Phys. Lett. 79:2001;3479.
5. Zhao X., Magtoto N.P., Leavy M., Kelber J.A. Thin Solid Films. 415:2002;308.
6. Guinn K.V., Donnelly V.M., Gross M.E., Baiocchi F.A., Petrov I., Greene J.E. Surf. Sci. 295:1993;219.
7. O'Kelly J.P., Mongey K.F., Gobil Y., Torres J., Kelly P.V., Crean G.M. Microelectron. Eng. 50:2000;473.
8. Dubin V.M., Shacham-Diamand Y., Zhao B., Vasudev P.K., Ting C.H. J. Electrochem. Soc. 144:1997;898.
9. Sausa R.C., Gupta A., White J.R. J. Electrochem. Soc. 134:1987;2707.
10. Zhang J.-Y., Boyd I.W. Solid State Electron. 43:1999;1107.
11. Keister J.W., Rowe J.E., Kolodziej J.J., Madey T.E. J. Vac. Sci. Technol. B. 18:2000;2174.
12. Lin T.C., Seshadri G., Kelber J.A. Langmuir. 14:1998;3673.
13. J.F. Moulder, W.F. Stickle, P.E. Sobol, K.D. Bomben, J. Chastain, R.C. King, Handbook of X-Ray Photoelectron Spectroscopy, Physical Electronics, Eden Prairie, MN, 1995.
14. M.P. Seah, Practical Surface Analysis, Wiley, New York, 1990.
15. Cumpson P.J., Seah M.P. Surf. Interface Anal. 25:1997;430.
16. C.J. Powell, A. Jablonski, NIST Electron Effective-Attenuation-Length Database - version 1.0, National Institute of Standards and Technology, Oaithersburg, MD, 2001.
17. Hill J.M., Royce D.G., Fadley C.S., Wagner L.F., Grunthaner F.J. Chem. Phys. Lett. 44:1976;225.
18. Seah M.P., Spencer S.J. Surf. Interface Anal. 33:2002;640.
19. Srinivas R.A., Rosen A., Heller A. J. Electrochem. Soc. 140:1993;3021.
20. Hedman J., Baer Y., Berndtsson A., Klasson M., Leonhardt G., Nilsson R., Nordling C. J. Electron Spectrosc. 1:1972/73;101.
21. Miller M.L., Linton R.W. Anal. Chem. 57:1985;2314.
22. Johansson G., Hedman J., Berndtsson A., Klasson M., Nilsson R. J. Electron Spectrosc. Relat. Phenom. 2:1973;295.
23. Klein T.M., Niu D., Epling W.S., Li W., Maher D.M., Hobbs C.C., Hedge R.I., Baumvol I.J.R., Parsons G.N. Appl. Phys. Lett. 75:1999;4001.
24. Guittet M.J., Crocombette J.P., Gautier-soyer M. Phys. Rev. B. 63:2001;125117.
25. Mekki A., Holland D., McConville C.F., Salim M. J. Non-Cryst. Solids. 208:1996;267.
26. Rhead G.E., Barthes M.-G., Argile C. Thin Solid Films. 82:1981;201.
27. Venables J.A., Spiller G.D.T., Hanbucken M. Rep. Prog. Phys. 47:1984;399.
28. M. Winter, http://www.webelements.com.
29. Silva L.A.D., Alves V.A., Castro S.C.D., Boodts J.F.C. Colloids Surf. A. 170:2000;119.
30. Peuckert M., Bonzel H.P. Surf. Sci. 145:1984;239.
31. Chu S.Z., Sakairi M., Takahashi H. J. Electrochem. Soc. 147:2000;1423.
32. Niu C., Shepherd K., Martini D., Tong J., Kelber J.A., Jennison D.R., Bogicevic A. Surf. Sci. 465:2000;163.
33. Eppler A.S., Rupprechter G., Anderson E.A., Somorjai G.A. J. Phys. Chem. B. 104:2000;7286.