Fabrication and performance limits of sub-0.1 μm Cu interconnects

Materials Research Society Symposium-Proceedings

Volumn 612, Issue , 2000, Pages D711-D718

  Kuan, T S ^a   Inoki, C K ^a   Oehrlein, G S ^a   Rose, K ^b   Zhao, Y P ^b   Wang, G C ^b   Rossnagel, S M ^c   Cabral, C ^c  

^a STATE UNIVERSITY OF NEW YORK   (United States)

^b RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^c IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; COMPUTER SIMULATION; COPPER; ELECTRIC CONDUCTIVITY; MONTE CARLO METHODS; PLASMA ETCHING; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY;

COPPER INTERCONNECTS;

METALLIC FILMS;

EID: 0034431455     PISSN: 02729172     EISSN: None     Source Type: Journal    
DOI: 10.1557/proc-612-d7.1.1     Document Type: Article

References (9)