Implication and solutions for Joule heating in high performance interconnects incorporating low-k dielectrics

Digest of Technical Papers - Symposium on VLSI Technology

Volumn , Issue , 1997, Pages 83-84

  Shih, W Y ^a   Chang, M C ^a   Havemann, R H ^a   Levine, J ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED DESIGN; DIELECTRIC FILMS; ELECTROMIGRATION; MATHEMATICAL MODELS; SEMICONDUCTING SILICON; SUBSTRATES; TEMPERATURE DISTRIBUTION; TRANSISTORS;

JOULE HEATING;

VLSI CIRCUITS;

EID: 0030715158     PISSN: 07431562     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/vlsit.1997.623706     Document Type: Conference Paper

References (4)