Athermal and thermally activated plastic flow in low melting temperature solders at small stresses

Scripta Materialia

Volumn 39, Issue 2, 1998, Pages 189-195

  McCabe, Rodney J ^a   Fine, Morris E ^a  

^a Northwestern University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DISLOCATIONS (CRYSTALS); ELASTIC MODULI; GRAIN SIZE AND SHAPE; LOW TEMPERATURE EFFECTS; MELTING; NUMERICAL ANALYSIS; PARTICLE SIZE ANALYSIS; PLASTIC FLOW; STRAIN HARDENING; STRAIN RATE; STRESS ANALYSIS; THERMAL STRESS;

LOW MELTING TEMPERATURE; PLASTIC STRAIN; SECANT YOUNG MODULI; STRESS STRAIN CURVES; THERMAL ACTIVATION;

SOLDERING ALLOYS;

EID: 0032083760     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(98)00149-3     Document Type: Article

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