Texture evolution in Copper film at high temperature studied in situ by electron back-scatter diffraction

Thin Solid Films

Volumn 496, Issue 2, 2006, Pages 703-717

  Mirpuri, K ^a,b   Wendrock, H ^a   Menzel, S ^a   Wetzig, K ^a   Szpunar, J ^b  

^a IFW DRESDEN   (Germany)

^b MCGILL UNIVERSITY   (Canada)

Author keywords

Copper; Electron back scatter diffraction; Stress; X ray diffraction

Indexed keywords

COPPER; ELECTRON DIFFRACTION; GRAIN SIZE AND SHAPE; HEAT TREATMENT; HIGH TEMPERATURE EFFECTS; TEXTURES; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

ELASTIC STRAIN ENERGIES; ELECTRON BACK-SCATTER DIFFRACTION (EBSD); ROOM TEMPERATURE;

METALLIC FILMS;

EID: 28144442621     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.08.353     Document Type: Article

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