Microbridge testing of plasma-enhanced chemical-vapor deposited silicon oxide films on silicon wafers

Journal of Applied Physics

Volumn 97, Issue 10, 2005, Pages

  Cao, Zhiqiang ^a   Zhang, Tong Yi ^b   Zhang, Xin ^a  

^a BOSTON UNIVERSITY   (United States)

^b HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

FILM CRACKING; MICROBRIDGE TESTING; STRESS-STRAIN RELATION; STRUCTURAL RELAXATION;

ELASTIC MODULI; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; MICROMACHINING; MICROSTRUCTURE; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; RAPID THERMAL ANNEALING; RESIDUAL STRESSES; SILICA; SILICON WAFERS; TESTING;

THIN FILMS;

EID: 20944444973     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1898449     Document Type: Article

References (39)

1. M. Gad-el-Hak, The MEMS Handbook (CRC, Boca Raton, 2002).
2. M. Madou, Fundamentals of Microfabrication: The Science of Miniaturization, 2nd ed. (CRC, Boca Raton, 2002).
3. M. Ohring, The Material Science of Thin Films (Academic, New York, 1992).
4. L. B. Freund and S. Suresh, Thin Film Materials: Stress, Defect Formation and Surface Evolution (Cambridge University Press, New York, 2004).
5. W. C. Oliver and G. M. Pharr, J. Mater. Res. 7, 1564 (1992).
6. J. A. Taylor, J. Vac. Sci. Technol. A 9, 2464 (1991).
7. J. J. Vlassak, M. D. Drory, and W. D. Nix, J. Mater. Res. 12, 1900 (1997).
8. S. P. Baker and W. D. Nix, J. Mater. Res. 9, 3131 (1994).
9. M. P. De Boer and W. W. Gerberich, Acta Mater. 44, 3177 (1996).
10. T.-Y. Zhang, L. Q. Chen, and R. Fu, Acta Mater. 47, 3869 (1999).
11. S. O. Kucheyev, J. E. Bradby, and J. S. Williams, Appl. Phys. Lett. 77, 3373 (2000).
12. T. Y. Zhang and W. H. Xu, J. Mater. Res. 17, 1715 (2002).
13. G. T. Mearini and R. W. Hoffman, J. Electron. Mater. 22, 623 (1993).
14. F. R. Brotzen, Int. Mater. Rev. 39, 24 (1994).
15. T. P. Weihs, S. Hong, J. C. Bravman, and W. D. Nix, J. Mater. Res. 3, 931 (1988).
16. K. Najafi and K. Suzuki, Thin Solid Films 181, 251 (1989).
17. G. M. Pharr and W. C. Oliver, MRS Bull. 17, 28 (1992).
18. J. Schweitz, MRS Bull. 17, 34 (1992).
19. A. L. Shull and F. J. Spaepen, J. Appl. Phys. 80, 6243 (1996).
20. J. J. Vlassak and W. D. Nix, J. Mater. Res. 7, 3242 (1992).
21. R. P. Vinci and J. J. Vlassak, Annu. Rev. Mater. Sci. 14, 225 (1996).
22. V. Ziebart, O. Paul, U. Munch, J. Schwizer, and H. Baltes, J. Microelectromech. Syst. 7, 320 (1998).
23. W. N. Sharpe, Jr., B. Yuan, and R. L. Edwards, J. Microelectromech. Syst. 6, 193 (1997).
24. H. D. Espinosa, B. C. Prorok, and M. Fischer, J. Mech. Phys. Solids 51, 47 (2003).
25. W. H. Xu, D. X. Lu, and T. Y. Zhang, Appl. Phys. Lett. 79, 4112 (2001).
26. C. M. Hernandez, T. W. Murray, and S. Krishnaswamy, Appl. Phys. Lett. 80, 691 (2002).
27. T.-Y. Zhang, Y.-J. Su, C.-F. Qian, M.-H. Zhao, and L.-Q. Chen, Acta Mater. 48, 2843 (2000).
28. Y.-J. Su, C.-F. Qian, M.-H. Zhao, and T.-Y. Zhang, Acta Mater. 48, 4901 (2000).
29. W.-H. Xu and T.-Y. Zhang, Appl. Phys. Lett. 83, 1731 (2003).
30. C. Moldovan, B.-H. Kim, S. Raible, and V. Moagar, Thin Solid Films 383, 321 (2000).
31. T. Matsuura, M. Taguchi, K. Kawata, and T. Tsutsumi, Sens. Actuators, A 60, 197 (1997).
32. Z. Cao and X. Zhang, J. Appl. Phys. 96, 4273 (2004).
33. J. Thurn and R. F. Cook, J. Appl. Phys. 91, 1988 (2002), and the references therein.
34. S. Timoshenko and S. Woinowsky-Krieger, Theory of Plates and Shells, 2nd ed. (McGraw-Hill, New York, 1959).
35. S. Timoshenko and J. Gere, Theory of Elastic Stability, 2nd ed. (McGraw-Hill, New York, 1961).
36. W. Fang, C.-H. Lee, and H.-H. Hu, J. Micromech. Microeng. 9, 236 (1999).
37. A. Merlos, M. C. Acero, M. H. Bao, J. Bausells, and J. Esteve, J. Micromech. Microeng. 2, 181 (1992).
38. S.-C. Chang and D. B. Hicks, J. Micromech. Microeng. 1, 25 (1990).
39. W. Fang, J. Micromech. Microeng. 8, 263 (1998).