Stress hysteresis during thermal cycling of plasma-enhanced chemical vapor deposited silicon oxide films

Journal of Applied Physics

Volumn 91, Issue 3, 2002, Pages 1988-1992

  Thurn, Jeremy ^a   Cook, Robert F ^a  

^a University of Minnesota   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITED; DEPTH SENSING INDENTATION; FILM PROPERTIES; HYDROGEN INCORPORATION; MECHANICAL RESPONSE; NET STRESS; SILANOL GROUPS; STATE OF STRESS; STRESS HYSTERESIS; SUBSTRATE CURVATURE; THERMAL COMPONENT;

HYDROGEN; HYSTERESIS; OXIDE FILMS; SILICON OXIDES; VAPORS;

THERMAL CYCLING;

EID: 0037084209     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1432773     Document Type: Article

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