Measurements of residual stresses in thin films deposited on silicon wafers by indentation fracture

Acta Materialia

Volumn 47, Issue 14, 1999, Pages 3869-3878

  Zhang, T Y ^a   Chen, L Q ^a   Fu, R ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLE FRACTURE; CHROMIUM; CRACKS; DEPOSITION; FRACTURE TOUGHNESS; MECHANICAL VARIABLES MEASUREMENT; RESIDUAL STRESSES; SILICA; SILICON WAFERS; VICKERS HARDNESS TESTING;

CRACK LENGTH; CUBIC OF SQUARE ROOT; INDENTATION LOAD; VICKERS INDENTATION FRACTURE TESTS; WAFER CURVATURE MEASUREMENT;

THIN FILMS;

EID: 0033350496     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(99)00248-7     Document Type: Article

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