Microbridge testing of silicon oxide/silicon nitride bilayer films deposited on silicon wafers

Acta Materialia

Volumn 48, Issue 20, 2000, Pages 4901-4915

  Su, Y J ^a   Qian, C F ^a   Zhao, M H ^a   Zhang, T Y ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; COMPUTER SIMULATION; DEPOSITION; ELASTIC MODULI; FILM PREPARATION; FINITE ELEMENT METHOD; MULTILAYERS; RESIDUAL STRESSES; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SUBSTRATES; THIN FILMS;

BILAYER FILMS; MICROBRIDGE TESTING;

SEMICONDUCTING FILMS;

EID: 0034514848     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(00)00290-1     Document Type: Article

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