The effect of PCB surface finish on lead-free solder joints

Soldering and Surface Mount Technology

Volumn 17, Issue 1, 2005, Pages 13-23

  Nurmi, Sami T ^a   Sundelin, Janne J ^a   Ristolainen, Eero O ^a   Lepistö, Toivo K ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

Joining processes; Solders; Surface treatment

Indexed keywords

ELECTROLESS PLATING; HEAT RESISTANCE; JOINING; MICROSTRUCTURE; PRINTED CIRCUIT BOARDS; SOLDERING ALLOYS; SURFACE TREATMENT; WETTING;

GLASS EPOXY; MICROSTRUCTURAL COARSENING; ORGANIC SOLDERABILITY PRESERVATIVE (OSP); UNDER BUMP METALLURGY (UBM);

SOLDERED JOINTS;

EID: 18844434708     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910510579203     Document Type: Conference Paper

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