Predicting the movement of voids in solder bumps and subsequent reliability [flip chip assembly]

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn 2000-January, Issue , 2000, Pages 97-102

  Bailey, C ^a   Lu, H ^a   Wheeler, D ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

Assembly; Displays; Heat transfer; Manufacturing processes; Materials reliability; Mobile handsets; Predictive models; Printed circuits; Thermal stresses; Video equipment

Indexed keywords

ASSEMBLY; CELLULAR TELEPHONE SYSTEMS; CHIP SCALE PACKAGES; DISPLAY DEVICES; ELECTRONICS PACKAGING; FINITE VOLUME METHOD; FLIP CHIP DEVICES; FLOW OF FLUIDS; HEAT TRANSFER; MANUFACTURE; PRINTED CIRCUITS; RELIABILITY; TELEPHONE SETS; TELEVISION EQUIPMENT; THERMAL STRESS;

FLIP CHIP ASSEMBLIES; INTELLIGENT DISPLAYS; MANUFACTURING PROCESS; MATERIALS RELIABILITIES; MOBILE HANDSETS; MULTI-PHYSICS MODELLING; PREDICTIVE MODELS; PRINTED CIRCUIT BOARD (PCBS);

PRINTED CIRCUIT BOARDS;

EID: 0012166555     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2000.906356     Document Type: Conference Paper

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