The influence of multiple reflow cycles on solder joint voids for lead-free PBGAs

Soldering and Surface Mount Technology

Volumn 15, Issue 1, 2003, Pages 31-38

  Nurmi, S T ^a   Sundelin, J J ^a   Ristolainen, E O ^a   Lepisto T ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

Lead free; Plastic ball grid array; Reliability

Indexed keywords

ADHESIVE PASTES; ELECTRONICS INDUSTRY; OPTIMIZATION; PRINTED CIRCUIT BOARDS; RELIABILITY; TIN ALLOYS;

LEAD FREE PLASTIC BALL GRID ARRAY; LEAD FREE SOLDER PASTE; MULTIPLE REFLOW CYCLES; TIN LEAD SILVER PLASTIC BALL GRID ARRAY COMPONENTS;

SOLDERED JOINTS;

EID: 0037215852     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910310455707     Document Type: Article

References (14)

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