Causes of voiding in plastic ball grid array eutectic solder joints

Soldering and Surface Mount Technology

Volumn 9, Issue 3, 1997, Pages 18-22

  Horsley, P M ^a   Ekere, N N ^b  

^a Design to Distribution Ltd   (United Kingdom)

^b UNIVERSITY OF SALFORD   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; EUTECTICS; MICROPROCESSOR CHIPS; RELIABILITY; SOLDERING ALLOYS;

EUTECTIC SOLDERS; VOIDING;

SOLDERED JOINTS;

EID: 0031247533     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (10)

1. Backs, D.R., et al., "The effects of solder joint voiding on pkastac bull grid array reliability". Proceedings of the Surface Mount International Technical Program. San Jose. CA. 10-12 Sepnember. 1996. pp. 121-6.
2. O'Hara, W.B. and Lee, N.C., "How voids develop in BGA solder joints". Surface Mount Technology. January 1996. pp. 44-7.
3. Gocnka, L., and Achari, A., "Void formation in flip-chip solder buarrps - party 1". Proceedings of IEEE/CPMT International Elictonics Manufacturing (IEMT) Symposium. 1995. pp. 14-19.
4. Hwang, J.S., Modern Solder Technology for Comperative Electronics Manufacturing. McGraw-Hill, New Youk, NY. 1996.
5. O'Hara, W.B. and Lee, N.C., "Formation and corrol of vording in SMT". Proceeding of ISHM. 1992. pp. 535-42.
6. Roos-Kazel, B., "Adcances in solder pablic technology to eliminate voids". Proceedings of Curcuit Expo. 1984. pp. 49-53.
7. Amockhneh. P. and Liu, S.T., "DOE - key to optimizing procees quality". Surface Mount Technology. February 1996. pp. 110-12.
8. Chatheld, C., Sactistics for Technology. 2nd ed., Chapiman & Hall. London. 1978. pp. 257-87.
9. John, P.W.M., Statistical Design and Analysis of Experiments. Macmillan. New York, NY. 1971. pp. 10-12.
10. Fisher, R.A., The Design of Experiments. 8th ed., Oliver and Boyd. London. 1996. pp. 93-108.