Effect of Au on interfacial reactions of eutectic SnPb and SnAgCu solders with Al/Ni(V)/Cu thin film metallization

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 726-731

  Zhang, Fan ^a   Chum, Chan Choy ^a   Li, Ming ^a  

^a INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

THIN FILM METALLIZATION;

GOLD; INTERMETALLICS; METALLIZING; PHASE TRANSITIONS; SURFACE CHEMISTRY; TERNARY SYSTEMS; THIN FILMS;

SOLDERING ALLOYS;

EID: 0036296077     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2002.1008178     Document Type: Conference Paper

References (12)

1. Brittle interfacial fracture of PBGA package solderd on electroless Ni/imersion Au
2. Solder metallization interdiffusion in microelectronic interconnects
3. Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after aging
4. 1-x)Sn in solder joints of ball-grid-array packages with the Au/Ni surface finish
5. Inhibiting growth of the Au0.5Ni0.5Sn4 intermetallic layer in Pb-Sn solder joints reflowed on Au/Ni metallization
6. Electron Microscopy study of interfacial reaction between eutectic SnPb and Cu/Ni(V)/Al thin film metallization
7. Estimating flip chip reliability: Interactive, temperature-dependent failure mechanisms involving the under bump metallurgy
8. Conversion of under bump metallurgy into intermetallics: The impact on flip chip reliability
9. Interfacial microstructure evolution between eutectic SnAgCu solder and Al/Ni(V)/Cu thin films
10. Flip chip reliability: Comparative characterization of lead free (Sn/Ag/Cu) and 63SnPb solder bumps