Reduction of voiding in eutectic ball grid array solder joints

Soldering and Surface Mount Technology

Volumn 11, Issue 2, 1999, Pages 12-16

  Casey, William ^a  

^a MCMS Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; EUTECTICS; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; SUBSTRATES;

EUTECTIC BALL GRID ARRAY (BGA) SOLDER JOINTS;

SURFACE MOUNT TECHNOLOGY;

EID: 0032637988     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540919910265631     Document Type: Article

References (4)

1. Bunks, R., Burnette, T., Cho, Y., Demarco, W. and Mawer, A. (1996), "The effects of solder joint voiding on plastic ball grid array reliability", Proceedings of Surface Mount International, Surface Mount International, San Jose, California, pp. 121-6.
2. Manko, H. (1986), Soldering Handbook For Printed Circuits and Surface Mounting, Von Nostrand, New York, NY.
3. Mawer, A., Bolton, S. and Mammo, E. (1994). "Plastic BGA solder joint reliability considerations", Proceedings of Surface Mount International, Surface Mount International, San Jose, California, pp. 239-51.
4. Wanda, B. and Lee, N. (1998), "Controlling solder joint voiding in BGA assembly", Surface Mount Technology Magazine, Vol. 12 No. 4, pp. 68-72.