Evaluation of two novel lead-free surface finishes

Soldering and Surface Mount Technology

Volumn 14, Issue 3, 2002, Pages

  Ludwig, Richard ^a   Lee, Ning Cheng ^a   Fan, Chonglun ^b   Zhang, Yun ^b  

^a INDIUM CORPORATION   (United States)

^b NOKIA RESEARCH CENTER   (United States)

Author keywords

Lead free; Reflow; Solder; Soldering; Surface finishing

Indexed keywords

BOND STRENGTH (MATERIALS); ELECTROLYSIS; LEAD; METAL FINISHING; NICKEL ALLOYS; PLATING; SHEAR STRENGTH; SOLDERING ALLOYS; SURFACE PHENOMENA; WETTING;

LEAD-FREE FINISHING;

SOLDERING;

EID: 18644374981     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910210444683     Document Type: Conference Paper

References (12)

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