The effect of multiple reflow times on lead-free solder joint microstructure

Advances in Electronic Packaging

Volumn 1, Issue , 2003, Pages 799-808

  Nurmi, Sami T ^a   Sundelin, Janne J ^a   Ristolainen, Eero O ^a   Lepistö, Toivo K ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

Lead free; Microstructure; PBGA; Reliability

Indexed keywords

ELECTRONICS INDUSTRY; LEAD ALLOYS; MICROSTRUCTURE; OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; STRAIN; THERMAL CYCLING; TIN ALLOYS; ELECTRONICS PACKAGING; LEAD; RELIABILITY; SILVER; SOLDERED JOINTS; SOLDERING; TIN;

MOLTEN STATES; ELECTRONICS PRODUCTS; ENVIRONMENTAL ISSUES; ENVIRONMENTAL-FRIENDLY; GENERAL TRENDS; INTERCONNECT RELIABILITY; LEAD FREE SOLDERS; LEAD-FREE; LEAD-FREE REFLOW; LEAD-FREE SOLDER JOINT; LEAD-FREE SOLDER PASTE; MICROSTRUCTURAL CHANGES; MOLTEN STATE; PBGA; PBGA COMPONENTS; REAL TIME MONITORING SYSTEM; SNAGCU SOLDER; SOLDER BUMP; SOLDER JOINTS; TIN-LEAD; TIN-LEAD SOLDERS; TIN-SILVER-COPPER; TIN-SILVER-COPPER SOLDERS;

SOLDERED JOINTS; SOLDERING ALLOYS;

EID: 1242331971     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35150     Document Type: Conference Paper

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