Crystallographic analysis of thin specimens

Journal of Microscopy

Volumn 218, Issue 2, 2005, Pages 115-124

  Sivel, V G M ^a   Tichelaar, F D ^b   Mohdadi, H ^c   Alkemade, P F A ^b   Zandbergen, H W ^b  

^a NETHERLANDS INSTITUTE FOR METALS RESEARCH   (Netherlands)

^b DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^c NONE

Author keywords

Copper gold alloy; EBSD; Focused ion beam; Lift out specimen; Orientation mapping; Sample thickness

Indexed keywords

BACKSCATTERING; BINARY ALLOYS; COPPER ALLOYS; FOCUSED ION BEAMS; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; QUALITY CONTROL; SIGNAL TO NOISE RATIO;

BACKSCATTERING DIFFRACTION; COPPER-GOLD ALLOY; CRYSTALLOGRAPHIC ANALYSIS; ELECTRON BACKSCATTERING; ELECTRON BACKSCATTERING DIFFRACTION; FOCUSED IONS BEAMS; LIFT OUTS; LIFT-OUT SPECIMEN; ORIENTATION MAPPING; SAMPLE THICKNESS;

GOLD ALLOYS;

ALLOY; COPPER; GOLD;

ARTICLE; CALCULATION; CRYSTALLOGRAPHY; ELECTRON BACKSCATTERING DIFFRACTION; ELECTRON DIFFRACTION; FOCUSED ION BEAM; IMAGE QUALITY; PARAMETER; PRIORITY JOURNAL; RELIABILITY; SAMPLE; SCANNING ELECTRON MICROSCOPY; SIGNAL NOISE RATIO; SURFACE PROPERTY; TECHNIQUE; THICKNESS; TRANSMISSION ELECTRON MICROSCOPY;

EID: 18444385680     PISSN: 00222720     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1365-2818.2005.01475.x     Document Type: Article

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